Ultrasonic Sensors Are Produced In The Industrial Field To Meet The Needs Of Various Applications

- Oct 15, 2018 -

 

    The successful experience of ultrasonic sensors in consumer electronics, especially smartphones, has turned the sensor into the beginning of all intelligence. With the development of the concept of Industry 4.0 in full swing, to implement Industry 4.0, the introduction of sensors became necessary, so the industrial market began to demand the sensor, and the related semiconductor industry began to flex their muscles.


ultrasonic application in industry detection


    The sensor is designed to meet a variety of application needs in a factory manufacturing environment. Including predictive maintenance and automation of mechanical production equipment, asset tracking and supply chain, real-time monitoring and calibration, shock detection and tampering, calculation of oil and electricity usage, and flow calculation water level monitoring. In the face of many manufacturers wanting to introduce Industrial 4.0 to achieve intelligent manufacturing, but worried about the need to completely replace the existing equipment, osenon believes that for existing production equipment, ST can help manufacturers to add sensors in a "plug-in" way, and then The sensor can be connected to the central control unit wirelessly; the new production equipment can be pre-installed in a “built-in” way, using wired or IO-Link connections, without the need for existing plant equipment. Too many changes.


    According to engineers in osenon, the existing monitoring method is that when the sensor collects many raw data from the motor or mechanical equipment, it directly transfers a large amount of data to the cloud for processing analysis and storage. The new monitoring method proposed by STMicroelectronics is Sensor fusion or adaptive sensor clustering and artificial intelligence collect data and pre-process data and alerts to deliver pre-processed data to the cloud, so that a lighter smart cloud architecture can be built.

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